A slew of leaked iPhone 7 casings have already given us a good idea of what Apple’s new device will look like on the inside, but we now have a better idea what it will pack on the inside, too, thanks to some photos out of Asia.

The leaked pictures claim to show a bare iPhone 7 logic board, revealing what the layout will look like before any chips have been placed on the board.

Take a look:

While we can’t verify the authenticity of the logic board, it does appear to be very similar to the design of the iPhone 6s logic board. The biggest change appears to be the placement of a chip in between the A10 processor and the SIM card slot.

Few other details were given about the logic boards that were posted by two different accounts on the Chinese micro-blogging site Weibo. One leaker also posted a video comparing the iPhone 7 logic board to the iPhone 6s logic board.

Some of the major internal upgrades on the iPhone 7 are expected to include an A10 that won’t be dramatically faster than the A9 processor in the iPhone 6s. Intel may also get inside the iPhone for the first time ever with a new LTE chip.

The iPhone 7 and iPhone 7 Plus are expected to be announced at an Apple event during the beginning of September. A dual-lens camera, pressure sensitive home button, improved waterproofing, refined chassis design, and a new color are the rumored major features.