iPhone chip-maker Taiwan Semiconductor Manufacturing Company (TSMC) enjoyed a 9% boost in revenue in November.
The increase can be attributed to strong demand for the company’s 7-nanometer chipsets, which power Apple’s latest crop of smartphones. And TSMC is confident the success will continue into the holidays.
This fall’s iPhone models will supposedly include a processor able to outperform any Android handset. It apparently won’t be just a little bit better, either. The source for this unconfirmed report on the A13 chip says it will offer “a one-year advantage” in graphics performance. Multi-core performance supposedly will get a large boost, too.
Strong demand for iPhone 7 and iPhone 7 Plus helped chipmaker Taiwan Semiconductor Manufacturing Company achieve record profits for 2016. Not only is TSMC outperforming its rivals, but it now accounts for 16 percent of Taiwan’s entire equity market value.
From the sound of things, Apple is focusing a lot of attention on next year’s iPhone launch as the biggest handset refresh since 2014’s iPhone 6 and 6 Plus.
Alongside OLED displays, wireless charging, an all-glass enclosure and a lack of physical home button, the iPhone 7s (or possibly iPhone 8 if certain rumors are to be believed) will also include a next-next-gen A11 chip. And Apple’s already working on it.
The Chipgate controversy upsetting iPhone 6s owners over the past 48 hours is completely overblown, Apple said this afternoon, claiming battery life on iPhone 6s units varies only slightly.
iPhone 6s and iPhone 6s Plus owners have discovered that devices with a TSMC A9 chip get considerably better battery performance than ones sporting an A9 made by Samsung, based on GeekBench 3 scores and some real-world testing. However, Apple says that “manufactured lab tests” that continuously run a heavy workload don’t represent the iPhone 6s’ true capabilities.
Taiwan Semiconductor Manufacturing Company (TSMC) has reached a deal with Apple to supply its next-generation A8, A9, and A9X processors for iOS devices, according to industry sources. The company will reportedly begin manufacturing the chips using a 20-nanometer process, then upgrade to 16-nanometer and later 10-nanometer processes in the future.