The CEO of chipmaker Broadcom said on Thursday an unnamed “North American mobile phone customer” won‘t be introducing a “next-generation phone” in the third quarter of this year, as it normally does. The release will occur in the fourth quarter instead.
This statement from Hock Tan is being widely interpreted to mean this iPhone component supplier doesn’t expect the next iOS handset to debut in September, the usual month.
Security researchers discovered a critical flaw in Wi-Fi chips made by Broadcom and Cypress Semiconductor that were used in Apple devices.
The discovery was presented at the RSA security conference in San Francisco this morning, revealing that billions of devices could have been affected. Attackers could use the vulnerability to decrypt private data sent over the air. Most manufacturers have already released a patch to fix the issue, but it’s unclear how many of the devices have been updated.
The following Apple devices were affected:
Apple has been ordered by a California jury to pay $837.7 million in damages for breaching Wi-Fi technology patents owned by the California Institute of Technology.
Apple says it plans to appeal the verdict.
Chipmaker Broadcom has inked two multi-year deals with Apple to sell it some $15 billion in wireless components for its iPhone product line, the company announced in an SEC filing on Thursday.
The announcement did not specify which components Broadcom would provide to the iPhone maker. The deals apply to “Apple products launched during the three and a half year period beginning in January 2020,” the chipmaker said.
Apple might be in the market to acquire the radio-frequency chip division from one of its biggest parts suppliers.
The Wall Street Journal reported today that Broadcom Inc is working with Credit Suisse to find a possible buyer of its RF wireless-chip unit in an effort to diversify its business and move more toward software. Although the names of companies potentially interested in the division haven’t been named, Apple observers are quickly pointing out that the iPhone-maker scooping it up makes the most sense.
Google has suspended its business with Huawei and revoked its Android license following a U.S. crackdown on Chinese technology companies.
It’s a massive blow for the world’s third-biggest smartphone-maker — and it’s not the only one it received this weekend. Intel, Qualcomm, and other chip manufacturers have also halted their partnerships with the company.
Some of the iPhone 8’s biggest new features could be disabled when the handset makes its debut this September.
A new report claims Apple is struggling to iron out software issues that are rendering wireless charging and another major feature unusable for now.
Chip orders reveal demand for the next-gen iPhones is set to exceed 50 million units during the second half of 2017, and hit a total of 220 million to 230 million units, according to a new report.
The new handsets are likely to be Apple’s biggest iPhone refresh since 2014’s iPhone 6 and 6 Plus-era devices, and promise to boast major new features. And it seems Apple’s willing to bank on that leading to massive demand!
iPhone-assembler Foxconn may be about to get some help from none other than Apple in its quest to buy Toshiba’s chipmaking business.
Apple is reportedly considering whether to make a huge multi-billion dollar investment in the world’s second-largest memory chip maker. If the deal goes through, it would give Foxconn and Apple a major advantage over other smartphone manufacturers.
Apple’s most important manufacturing parter is getting ready to make a huge investment that could make it one of the world’s biggest chipmakers.
The Japanese government is hoping Toshiba will sell itself to a domestic company, but Taiwan’s Hon Hai Precision Industries (aka Foxconn) is preparing to make a huge offer for the company that could shake up the tech world.
