Apple is preparing to team up with Intel for the upcoming iPhone 7, according to sources familiar with its plans. The chip maker is expected to supply up to 50 percent of Apple’s LTE modems for the new device.
From the sound of things, Apple is focusing a lot of attention on next year’s iPhone launch as the biggest handset refresh since 2014’s iPhone 6 and 6 Plus.
Alongside OLED displays, wireless charging, an all-glass enclosure and a lack of physical home button, the iPhone 7s (or possibly iPhone 8 if certain rumors are to be believed) will also include a next-next-gen A11 chip. And Apple’s already working on it.
TSMC is reportedly the only manufacturer set to build A10 chips for the upcoming iPhone 7 — and it’s spending the money necessary to not only fulfil Apple’s orders this year, but hopefully to secure future A-series chip orders, as well.
Taiwan Semiconductor Manufacturing Company (TSMC) might be on course to take over 100 percent of Apple’s A10 chip orders, but that’s not to say that it’s entirely without problems right now.
According to a new report, a recent earthquake which hit one of TSMC’s factories in southern Taiwan caused more damage than initially thought: with resulting wafer shipments for the first quarter of 2016 likely to fall as a result.