Adding to the pile of leaked iPhone 6 parts ahead of next month’s great unveiling, a new photo from China has given us our first look at a fully assembled iPhone 6 logic board and some of the new components Apple will add to the smartphone this year.
Previous leaks gave us a glimpse of a bare iPhone 6 logic board, but the image obtained by Nowhereelse.fr reveals some of the iPhone 6 modules, though some of the most interesting bits are covered by electromagnetic shielding.
Clearly visible in the somewhat blurry photo, is a Flash Storage module in the middle made by Toshiba. Other components include a Wi-Fi module, SIM card slot, and the new A8 processor which is hidden behind a metal plate.
While we can’t verify the authenticity of the parts, they do correspond with previous leaks. And with production reaching full steam over the next weeks we’re likely to see more high quality leaks. The iPhone 6 is expected to be announced on September 9th with a 4.7-inch display, A8 processor, improved camera, and possibly a sapphire glass display..